Kupisa Shrinkable Breakout

Tsanangudzo Pfupi:

- Minimum shrink tembiricha: 110 ℃

- Yakazara shrink tembiricha: 130 ℃

- Muvara wakajairwa: Kupisa kwakasviba kupfupisa tambo yekutyora bhutsu

- RoHS inoenderana

- Mechanical kudzivirira
- Kuramba kwakanaka kumvura, kupisa uye makemikari zvinonyungudutsa


Product Detail

Product Tags

Technical Data

Property Test Method Typical Data
Kushanda tembiricha IEC 216 -55 ℃ kusvika +110 ℃
Kusimba simba ASTM D 2671 13MPa(min.)
Kusimba kwesimba mushure mekuchembera kwekupisa (120 ℃/168hrs.) ASTM D 2671 10Mpa(min.)
Elongation panguva yekuzorora ASTM D 2671 300% (min.)
Kureba panguva yekuzorora mushure mekuchembera kwekupisa (120 ℃/168hrs.) ASTM D 2671 250% (min.)
Dielectric simba IEC 243 15kv/mm(min.)
Volume resistance IEC 93 1013Ω.cm(min.)
Kutorwa kwemvura ISO 62 1% (max.)

Tsanangudzo

4

  • Zvakapfuura:
  • Zvinotevera:

  • Nyora meseji yako pano uye titumire kwatiri